JPH0367442U - - Google Patents
Info
- Publication number
- JPH0367442U JPH0367442U JP12930189U JP12930189U JPH0367442U JP H0367442 U JPH0367442 U JP H0367442U JP 12930189 U JP12930189 U JP 12930189U JP 12930189 U JP12930189 U JP 12930189U JP H0367442 U JPH0367442 U JP H0367442U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- protective sheet
- peeling device
- tape
- release tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001681 protective effect Effects 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989129301U JPH0749796Y2 (ja) | 1989-11-07 | 1989-11-07 | ウエハの保護シート剥がし装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989129301U JPH0749796Y2 (ja) | 1989-11-07 | 1989-11-07 | ウエハの保護シート剥がし装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0367442U true JPH0367442U (en]) | 1991-07-01 |
JPH0749796Y2 JPH0749796Y2 (ja) | 1995-11-13 |
Family
ID=31676940
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989129301U Expired - Lifetime JPH0749796Y2 (ja) | 1989-11-07 | 1989-11-07 | ウエハの保護シート剥がし装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0749796Y2 (en]) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004207719A (ja) * | 2002-12-23 | 2004-07-22 | Samsung Electronics Co Ltd | 半導体パッケージの組立て方法及び半導体パッケージ工程の保護テープの除去装置 |
JP2007057986A (ja) * | 2005-08-25 | 2007-03-08 | Nakabayashi Co Ltd | 路線図 |
JP2007171472A (ja) * | 2005-12-21 | 2007-07-05 | Pia Corp | 地図 |
JP2007214343A (ja) * | 2006-02-09 | 2007-08-23 | Disco Abrasive Syst Ltd | 保護テープの剥離方法 |
JP2008072134A (ja) * | 2007-10-15 | 2008-03-27 | Lintec Corp | シート剥離装置および方法 |
CN101969018A (zh) * | 2009-07-16 | 2011-02-09 | 株式会社高鸟 | 保护胶带的剥离装置 |
JP2012028814A (ja) * | 2011-10-24 | 2012-02-09 | Lintec Corp | シート剥離装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60187541U (ja) * | 1984-05-21 | 1985-12-12 | 三菱電機株式会社 | 半導体ウエ−ハの保護テ−プはがし装置 |
JPH01272129A (ja) * | 1987-11-28 | 1989-10-31 | Nitto Denko Corp | 保護フイルムの剥離方法 |
-
1989
- 1989-11-07 JP JP1989129301U patent/JPH0749796Y2/ja not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60187541U (ja) * | 1984-05-21 | 1985-12-12 | 三菱電機株式会社 | 半導体ウエ−ハの保護テ−プはがし装置 |
JPH01272129A (ja) * | 1987-11-28 | 1989-10-31 | Nitto Denko Corp | 保護フイルムの剥離方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004207719A (ja) * | 2002-12-23 | 2004-07-22 | Samsung Electronics Co Ltd | 半導体パッケージの組立て方法及び半導体パッケージ工程の保護テープの除去装置 |
JP2007057986A (ja) * | 2005-08-25 | 2007-03-08 | Nakabayashi Co Ltd | 路線図 |
JP2007171472A (ja) * | 2005-12-21 | 2007-07-05 | Pia Corp | 地図 |
JP2007214343A (ja) * | 2006-02-09 | 2007-08-23 | Disco Abrasive Syst Ltd | 保護テープの剥離方法 |
JP2008072134A (ja) * | 2007-10-15 | 2008-03-27 | Lintec Corp | シート剥離装置および方法 |
CN101969018A (zh) * | 2009-07-16 | 2011-02-09 | 株式会社高鸟 | 保护胶带的剥离装置 |
JP2012028814A (ja) * | 2011-10-24 | 2012-02-09 | Lintec Corp | シート剥離装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0749796Y2 (ja) | 1995-11-13 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |